In Investing US announces $1.4 billion support for next-generation semiconductor advanced packaging January 16, 2025 No Comments (Reuters) – The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of semiconductor advanced packaging. This post appeared first on investing.com 0 Author Related Posts Scott Bessent’s hearing for Treasury Secretary: tariffs, taxes and spending in focus January 16, 2025 Tariff-fuelled dollar gains pose global stagflation risks, BIS warns January 16, 2025 WHO calls for international support to fund aid in Gaza after ceasefire deal January 16, 2025
Scott Bessent’s hearing for Treasury Secretary: tariffs, taxes and spending in focus January 16, 2025